Chapter 14 design for manufacturabilitynote.
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Device sizing and logical effort.
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All solutions numbered 15 x x 1 through 15 on the following pages apply to exercise problems numbered 14 x in the 3rd edition.
Interconnect models and parasitics.
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Mos device models including deep sub micron effects.
Analysis and design continues the well established tradition of the earlier editions by offering the most comprehensive coverage of digital cmos circuit design as well as addressing state of the art technology issues highlighted by the widespread use of nanometer scale cmos technologies.
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The third edition of hodges and jackson s analysis and design of digital integrated circuits has been thoroughly revised and updated by a new co author resve saleh of the university of british.
Estimation and minimization of energy consumption.
Circuit design styles for logic arithmetic and sequential blocks.
The new edition combines the approachability and concise nature of the hodges and jackson classic with a complete overhaul to bring the book into the 21st century.
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Analysis and design of digital integrated circuits.
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In deep submicron technology inproceedings hodges2003analysisad title analysis and design of digital integrated circuits.
Timing issues clock skew and jitter and.
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6 374 examines the device and circuit level optimization of digital building blocks.